Quality Assurance
  Capability
  Equipment
  Design Tips

Capability

 
for more detail about our capability, please download this file
PCB Manufacture Capabilities
No
Items Capabilities(for Sample) Capabilities(for Mass Production)
1
Layer count 1-30L 1-16 Layer
2
Board Thickness 0.2-7.0mm 0.4-6.0mm
3
Maximum Board Size 610*1100mm 550*650mm
4
Copper Thickness Inner Layer: H-6OZ Inner Layer: H-4OZ
Outer Layer: H-7OZ Outer Layer: H-5OZ
5
Minimum Finished Hole Size 0.1mm 0.15mm
6
Hole Diameter Tolerance PTH: 0.05mm PTH: 0.075mm
NPTH: 0.05mm NTTH: 0.05mm
7
Maximum Aspect Ratio 16:1 10:1
8
Minimum Line Width 3.0mil 3.0mil
9
Minimum Line Spacing 3.0mil 3.0mil
10
Outline Size Tolerance 0.10mm 0.15mm
11
Minimum Bow and Twist 0.50% 0.75%
12
Soldermask Color Green,Yellow,Black,Blue,
Red,White,Purple
Green,Yellow,Black,Blue,
Red,White,Purple
13
Minimum Solder Mask Dam 4mil(Green),
5mil(Other color)
4mil(Green),
5mil(Other color)
14
Silkscreen Color White,Yellow,Black White,Yellow,Black
15
HASL Tin Thickness 2-40um 2-40um
16
Flash Gold(electroplated gold) Ni:3um;Au:0.025-0.1um Ni:3um;Au:0.025-0.1um
17
ENIG Ni:3-8um;Au:0.05-0.1um Ni:3-8um;Au:0.05-0.1um
18
Immersion Tin 1.0um 1.0um
19
Immersion Silver 0.2-0.4um 0.2-0.4um
20
OSP 0.1-0.3um 0.1-0.3um
21
Hard Gold 0.1-4.0um 0.1-4.0um
22
ENEPIG Ni:3-8um;
Pd:0.05-0.15um;
Au:0.05-0.1um
Ni:3-8um;
Pd:0.05-0.15um;
Au:0.05-0.1um
23
Carbon 0.10-0.35um 0.10-0.35um
24
Peelable Solder mask 0.20-0.50mm 0.20-0.50mm
25
Raw Material FR-4,High Tg FR-4,
Halogen-Free,PTFE,Aluminum
base material,Ceramic Partide Filled Laminates
FR-4,High Tg FR-4,Halogen-Free,PTFE,Aluminum base material,Ceramic Partide Filled Laminates
26
Surface Treatment

Sn/Pb HASL,
Leadfree HASL,
FlashGold,
ENIG,Immersion Tin,
Immersion Silver, OSP(Entek),Hard Gold,
Soft Gold,ENIG+OSP,
ENIG+Gold finger,
Hard Gold+Gold finger,
Immersion Silver+Gold finger,
Immersion Tin+Gold finger,ENEPIG

Sn/Pb HASL,
Leadfree HASL,
FlashGold,ENIG,
Immersion Tin,
ImmersionSilver,
OSP(Entek),
Hard Gold,Soft Gold,
ENIG+OSP,
ENIG+Gold finger,

Hard Gold+Gold finger,
Immersion Silver+Gold finger,Immersion Tin+Gold finger,ENEPIG

 
   
 
 
Copyrigth © 2010 Bestech Circuits (HK) Limited.All rights reserved.
Room 0523-0527,Building1,Wanjunhui business building,xixiang,BaoAn Dist,Shenzhen,China.
Tel:(860755) 2918 5755 Fax:(860755) 8625 1678 Email: sales@bestechcircuits.com
Home  |  About Us  |  Products  |  Services  |  Quality&Capability  |  News  |  Contact